Umzi-mveliso weChip ukongeza ama-38 amatsha amalaphu angama-300mm ngo-2024
Utyalo-mali lwe-300mm lwe-fab ngo-2020 luya kukhula nge-13% unyaka nonyaka (YoY) ukuze luthintele irekhodi langaphambili elisetiweyo ngo-2018 kwaye lifake omnye unyaka webhena kumzi-mveliso we-semiconductor ngo-2023, i-SEMI ibike namhlanje kwi-300mm Fab Outlook ukuya ku-2024. Ubhubhani we-COVID-19 ubangele ukunyuka kuka-2020 kwinkcitho yelaphu ngokukhawulezisa iinguqu zedijithali kwihlabathi liphela, kwaye ukonyuka kulindeleke ukuba kunwenwele ukuya kutsho ngo-2021.
Ukunika amandla ukukhula kukukhula kwemfuno yeenkonzo zelifu, iiseva, iilaptops, imidlalo kunye netekhnoloji yezempilo.Ubuchwephesha obukhawulezayo obufana ne-5G, i-Intanethi yezinto (i-IoT), i-automotive, intelligence intelligence (AI) kunye nokufunda komatshini oqhubekayo nokunyusa imfuno yokudibanisa okukhulu, amaziko amakhulu edatha kunye nedatha enkulu nazo zisemva kokunyuka.
"Ubhubhani we-COVID-19 ukhawulezisa inguqu yedijithali etyhutyha phantse kuwo wonke umzi-mveliso onokucinga ukuba uhlengahlengise indlela esisebenza ngayo nesiphila ngayo," utshilo u-Ajit Manocha, umongameli we-SEMI kunye ne-CEO."Inkcitho yerekhodi eqikelelweyo kunye namalaphu amatsha angama-38 yomeleza indima yee-semiconductors njengesiseko setekhnoloji ekhokelayo eqhuba olu tshintsho kwaye ithembisa ukunceda ukusombulula eyona mingeni mikhulu yehlabathi."
Ukukhula kwi-semiconductor fab investments kuya kuqhubeka ngo-2021 kodwa ngesantya esicothayo se-4% YoY.Ijonga umjikelo wangaphambili weshishini, ingxelo ikwaqikelela ukwehla okuncinci ngo-2022 kunye nokunye ukuhla okuncinci ngo-2024 kulandela irekhodi ye-70 yeebhiliyoni zeedola ephezulu ngo-2023.
Ukongeza iiFabhu ezingama-38 ezitsha ze-300mm
I-SEMI 300mm Fab Outlook ukuya ku-2024 ibonisa ishishini letshiphu lisongeza ubuncinci ama-38 amatsha omthamo we-300mm amalaphu ukusuka ngo-2020 ukuya ku-2024, uqikelelo oluluqilima olungabandakanyi kumathuba aphantsi okanye iiprojekthi zefab ezihlehlisiwe.Kwangelo xesha linye, umthamo welaphu ngenyanga nganye uya kukhula malunga ne-1.8 yezigidi zeewafers ukuya kuthi ga kwi-7 yezigidi.
Ngaphantsi koqikelelo oluphezulu lweprojekthi, imboni iya kongeza ubuncinane i-38 entsha ye-300mm ye-volume fabs ukusuka kwi-2019 ukuya kwi-2024. I-Taiwan iya kwongeza i-11 ye-volume fabs kunye ne-China ezisibhozo kwi-akhawunti yesiqingatha salo lonke.Umzi-mveliso weetshiphu uya kuyalela i-161 300mm iilaphu zevolumu ngo-2024.
Ukukhula kwenkcitho ngokweCandelo leMveliso
Imemori ibalelwa kubuninzi bokunyuka kwenkcitho ye-300mm yefab.Okwenyani kunye noqikelelo lotyalo-mali lubonisa ukonyuka okuthe gqolo kumanani aphezulu ngonyaka ngamnye ukusuka ngo-2020 ukuya kuma-2023, ngokunyuka okunamandla nge-10% egciniweyo ngo-2024.
Igalelo le-DRAM kunye ne-3D NAND kwi-300mm yenkcitho yefab iya kungalingani ukusuka ku-2020 ukuya ku-2024. Utyalo-mali lwengqiqo/MPU, nangona kunjalo, luza kubona ukuphucuka okuzingileyo ukusuka ku-2021 ukuya ku-2023. Ukukhula kwe-200% ngo-2021 kunye nokunyuka kwamanani aphindwe kabini ngo-2022 kunye no-2023.
Ukulandelela amalaphu angama-286 kunye nemigca ukusuka ku-2013 ukuya ku-2024, i-300mm Fab Outlook ukuya ku-2024 ibonisa uhlaziyo lwama-247 kwiifabhu ezili-104, uluhlu olutsha olulithoba kunye noluhlu lwemigca, kunye nokurhoxiswa kabini ukusukela ekupapashweni kwengxelo kaMatshi ka-2020.
Ixesha lokuposa: 10-03-21